Hot melt molding service
Hot melt molding that achieves ecology with solvent-free resin.
Our company conducts "hot melt molding," which allows us to inject low-melting-point thermoplastic resin into molds under low pressure, adding diverse and excellent protective performance to various electronic components through insert molding. Compared to conventional methods, this reduces damage to delicate electronic components. Furthermore, it enables improvements in productivity, as well as weight reduction and miniaturization. Additionally, since the external shape can be directly molded, it also contributes to enhanced design quality. 【Technical Overview】 ■ Molding Temperature: 170–240°C ■ Molding Pressure: 1–30 MPS ■ Curing Time: Several seconds to a few minutes ■ Resin: Solvent-free ■ Design: No case required ■ Inserted Components: Minimal damage *For more details, please download the PDF or feel free to contact us.
- Company： 倉田電子
- Price：Other
